Vacuum Dry Film Photoresist Laminators
Supplied, sold and supported by Petrano Supply Inc. in Canada.
Fully automated vacuum lamination of dry film photoresist on 200 and 300 mm wafers.
Overview
Automated vacuum lamination systems that apply dry film photoresist to 200 and 300 mm wafers for semiconductor packaging and MEMS processing. Systems handle silicon, glass, bonded and polymer (EMC) substrates, integrate vision alignment, heated-roller vacuum lamination, laser film cutting and cover film removal, and support SEMI-standard factory automation. Petrano coordinates cleanroom delivery, including through-wall bulkhead configurations, with installation and training for Canadian facilities.
Applications
- Semiconductor packaging
- MEMS and microfabrication
- Advanced packaging R&D
Key specifications
| Wafer sizes | 200 mm and 300 mm |
|---|---|
| Substrates | Silicon, glass, bonded, polymer (EMC) |
| Alignment | Non-contact vision, ±25 µm centering, ±0.02° theta |
| Process | Heated-roller vacuum lamination (≤100 Pa), laser cut, cover film removal |
| Automation | Dual load ports, SEMI E84 / E87, GEM 300 host communication |
| Installation | ISO 4 to ISO 6 cleanrooms; through-wall bulkhead capable |
| Full specifications | Confirmed at quotation |
Specifications are provided by the manufacturer, are for general information only, may change without notice, and are confirmed at quotation.
Third-party brands are used for identification only unless an authorized relationship is expressly stated.
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